CPU |
Support 9th/8th generation Intel® Core™ i7/i5/i3 LGA1151 socket - Intel® Core™ i7-9700TE, 1.8 GHz, 35W, 8 core |
Chipset | Intel® Q370 platform controller hub |
Memory | 2-Channel 260-pin DDR4 SO-DMIM sockets up to 32GB/channel (64GB for two channels, non-ECC up to 2666 MHz), default 4GB + 4GB industrial grade memory |
Video Output | Chipset Intel® UHD graphics 630 1 x Waterproof VGA up to 1920 x 1200 @ 60Hz 1 x HDMI 1.4b up to 4096 x 2160 @ 30Hz |
Storage | 2 x 2.5” SATA 3.0 external SSD/HDD (compatible with 15mm height), RAID 0/1 supported 2 x mSATA 3.0 (BIOS selection, occupied mPCIe slot) |
Expansion | 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0 (BIOS selection)) 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0 (BIOS selection)), BOM optional full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM 1 x Full size mini-PCIe socket (USB 2.0) for LTE module, BOM optional M.2 3042 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 2 x external SIM 1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 2 x external SIM 1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2, PCIe 3.0 (BOM optional)) for LTE/5G NR modem with 2 x external SIM |
GNSS and Onboard Sensor | 1 x Default U-blox NEO-M8N GNSS module for GPS/Gloness/QZSS/ Galileo/Beidou G Sensor (3-axis, 10-bit resolution) |
LAN and Power over Ethernet | 4 x Independent LAN, 10/100/1000 Mbps I210-IT GbE, PoE 802.3af/at, max. 60W 1 x LAN, 10/100/1000 Mbps I219 support iAMT and WOL |
Security | TPM 2.0: Infineon SLB9665TT2.0FW5.62 |
I/O Interface-Front | 21 x LED indicators (including 4 x programmable LED) 6 x Externally accessible SIM card sockets (4 x WWAN + 8 x SIM, BOM optional) w/ cover 1 x Reset button 2 x 2.5” external SSD/HDD 12 x SMA antenna hole 3 x USB 3.1 Gen1 type A (5V/1A) 1 x USB 3.1 Gen2 type A (5V/1A) |
I/O Interface-Rear |
4 x M12 X-coded PoE 802.3af/at, max. 60W
1 x M12 X-coded LAN port, 10/100/1000 Mbps
1 x Waterproof DC input connector with ignition, male type
1 x M8 for 1 x Mic-in, 1 x Line-out
2 x Waterproof DB9 (COM1/COM2) for full RS232 (isolation)
1 x Waterproof DB9 (COM3) for full RS232/422/485 (isolation)
1 x M12 A-coded 10pin (DIO) - 4 x DI and 4 x DO (isolation) - Power in for DIO isolation, 9~36VDC 1 x M12 A-coded for 2 x USB 2.0 1 x VGA 1 x HDMI |
Power Management & Software Support | Power input 24 VDC w/o isolation Reverse protection, OCP & UVP Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software 10~255 seconds WDT support, setup by software SDK (Windows/Linux) including utility and sample code |
Operating System | Windows 10 Linux |
Dimensions | 260 x 256 x 84 (W x D x H) (mm) |
Weight | 4.6kg |
Environment |
Operating temperatures - EN 50155, class OT4 (-40~70°C), 85°C for 10 minutes (w/ 35W TDP CPU, industrial SSD) with air flow Storage temperatures: -40°C~80°C Relative humidity: 90% (non-condensing) Vibration (random) - 2g@5~500 Hz (in operation, SSD) Vibration (SSD) - Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure - Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test Shock (SSD) - Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g - Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g |
Certifications |
CE
FCC Class A
EN 50155: 2017 - Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes - Interruptions of voltage supply class S1 - Supply change over class C1, C2 - EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 - Shock and vibration IEC 61373 Class B - Protective coating class PC1 (PC2, by request) EN 45545-2:2013+A1:2015 (PCB) |